However, a research conducted by 3DNews web-site has revealed that the NGPTIM is far less efficient than even affordable thermal pastes available on the market. With the latest “Devil’s Canyon” central processing units Intel started to use a new substance called the NGPTIM, which is more efficient than its predecessors. Many overclockers complained that in order to unlock maximum overclocking potential of the Core i7-3770K and the Core i7-4770K microprocessors they had to remove the heat-spreaders (de-lid the chips) and change thermal interface. However, starting from the code-named Ivy Bridge microprocessors Intel replaced the solder with a layer of thermal paste, which is considerably less efficient than the previously used alloy. Back in the days Intel soldered dies to heat-spreaders using a special Indium-based alloy, which enabled very efficient transfer of heat. ![]() Apparently, the reason for that is quite simple: the new thermal interface that Intel uses still has limited efficiency.Īll Intel processors for desktop computers in the recent 15+ years have featured heat-spreaders (which many call lids) on their dies to protect the latter from damages and enable more efficient heat dissipation. However, actual overclocking attempts of a Core i7-4790K central processing unit by KitGuru’s reviewer Luke Hill did not reveal any breakthroughs. Intel Corp.’s NGPTIM, which was supposed to bring back record overclocking capabilities to the company’s processors is better than its predecessor, but is significantly worse than commercially available thermal interfaces, a new research has found out.Įarlier this year Intel Corp.’s promised that its Core i7-4790K and Core i7-4690K “Devil’s Canyon” microprocessors will have considerably better overclocking potential compared to the original chips based on the “Haswell” micro-architecture released last year thanks to improved thermal interface between the die and the heat-spreader as well as revamped power supply circuity.
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